1、of MOSFET is consisted of five main processes, which are wafer sawing, die attach, wire bond, molding, trim and form.───MOSFET的封装主要由晶圆切割，晶粒黏贴，焊线，封塑，切割成型这五大流程组成。
2、Explore New Challenges of Wafer Level Die Attach Film for Wafer Preparation Process───探索晶圆级芯片贴装薄膜和芯片制备集成工艺的新挑战
3、The five company consortium is known as the DA5 (Die Attach 5).───这五个公司财团是被称为DA5（模具附加5）。
4、Wafer Backside Coating of Die Attach Adhesives───固晶粘合剂在晶圆背面的涂覆
5、The assembly of MOSFET is consisted of five main processes, which are wafer sawing, die attach, wire bond, molding, trim and form.───MOSFET的封装主要由晶圆切割，晶粒黏贴，焊线，封塑，切割成型这五大流程组成。
6、Enter Lower right corner. Using track ball move crosshair to lower right corner of the die attach pad. Press ENTER.───确定右下角的中心。按标线来移动跟踪球到邦垫或者邦线的中心，然后按回车确定。
7、Today, semiconductor products use high-lead containing solder for a die attach material in various devices.───今天，半导体产品使用高含铅的各种设备，模具材料附着焊锡。
8、Consider die attach and bonding issues, we choose the platform shape holder as our main structure when design the LED lamp.───考量固晶及打线技术，因此以平台式为主要发光二极体支架结构并进行透镜设计。
die attach（意思翻译）
管芯连接；芯片键合
die attach（相似词语短语）
1、die die die───死吧，死吧
2、attach to───vt.依附，附属；加入；使依恋；把…放在；（使）贴[系，粘]在…上; （使）相关; （使）牵连; （使）依附
3、die me die───死吧我死吧
4、die die───模具
5、die───vt.死，死于……；vi.死亡；凋零；熄灭；n.冲模，钢模；骰子；n.(Die)（法、美、德）迭（人名）
6、attach proposal───附上建议书
7、attach view───附加视图
8、attach───vi.附加；附属；伴随；vt.使依附；贴上；系上；使依恋
9、die my die───死吧，我的死
die attach（双语使用场景）
1、of MOSFET is consisted of five main processes, which are wafer sawing, die attach, wire bond, molding, trim and form.───MOSFET的封装主要由晶圆切割，晶粒黏贴，焊线，封塑，切割成型这五大流程组成。
2、Explore New Challenges of Wafer Level Die Attach Film for Wafer Preparation Process───探索晶圆级芯片贴装薄膜和芯片制备集成工艺的新挑战
3、The five company consortium is known as the DA5 (Die Attach 5).───这五个公司财团是被称为DA5（模具附加5）。
4、Wafer Backside Coating of Die Attach Adhesives───固晶粘合剂在晶圆背面的涂覆
5、The assembly of MOSFET is consisted of five main processes, which are wafer sawing, die attach, wire bond, molding, trim and form.───MOSFET的封装主要由晶圆切割，晶粒黏贴，焊线，封塑，切割成型这五大流程组成。
6、Enter Lower right corner. Using track ball move crosshair to lower right corner of the die attach pad. Press ENTER.───确定右下角的中心。按标线来移动跟踪球到邦垫或者邦线的中心，然后按回车确定。
7、Today, semiconductor products use high-lead containing solder for a die attach material in various devices.───今天，半导体产品使用高含铅的各种设备，模具材料附着焊锡。
8、Consider die attach and bonding issues, we choose the platform shape holder as our main structure when design the LED lamp.───考量固晶及打线技术，因此以平台式为主要发光二极体支架结构并进行透镜设计。